Leaded Conversion Services

Intransit Technologies’ Leaded Conversion services are similar to our RoHS Conversion Services, but doing the opposite.  We can replace the current solder to a leaded solder or your solder of choice.   This service is mainly requested by DoD contractors or the Medical industry as their requirements for higher reliability in solder is demanded.  Using a leaded solder does come with some advantages in reliability, but is limited to only a few industries due to the toxic nature of lead.

 

Frequently Asked Questions

 

What is RoHS Conversion?

Through a process of hot solder dipping we are able to convert the terminals on IC or Passive component packages to a RoHS based solder.  

 

What is Leaded Conversion? 

We can convert a RoHS solder based device by adding a LEADED Non-RoHS solder to the terminals/pins for mainly the military or medical applications where higher reliability is required and authorized by industry standards.

 

What are the solders available that you can retin or reball with?

Our main choice for RoHS conversion is SAC305( Sn96.5 Ag3.0 Cu.5), but to list some other and some include lead depending on you needs are; Sn63 Pb37, Sn5 Pb93.5 Ag1.5, Sn96.5 Ag3.5 and we have worked with many customer requested solders to meet a special need. 

 

What type of packages can you work with?

Bulk, Tape and Reel, Tube and Trays.

 

What can you do automated?
Trays can be automated via our robotic machine to handle the pickup/load to auto flux to solder dip to place back in tray/unload.  All the parts in the tray can be handled without human touch.

 

Do you bake the parts to ensure no damage occurs during services?
Yes! We bake the parts prior to a job and after a job to ensure there is no moisture inside the parts.  This is a critical step to keep the integrity of the parts throughout the job. 

 

Testing Services?
XRF testing, Solderability testing, S-CAM, X-RAY and many others.  Please inquire about the specific testing service you’d like and we can quote it accordingly.

 

My ICs are on PCBs; can you salvage these and convert them to RoHS compliant , Leaded or your preferred solder?
YES. Most IC packages from all types of PCBs. We can safely salvage devices using specially developed controlled IR, Hot-air or by chemical solder removal with no or minimal stress on the salvaged device. Salvaged devices can then be converted.

 

Can you convert Discrete devices?
Yes. We can convert almost all discrete devices both active and passive provided their levels of banned substances (apart from Lead) are below their respective RoHS thresholds.

 

What IC, PASSIVE, BGA, DISCRETE and other component packages can you convert or repair?

Almost all IC packages can be converted to Pb-free. This includes BGA, PGA, TSOP, SSOP, QFP, SOIC, PLCC, CDIP, PDIP and customized packages.

 

 

Acronym	Full name	Remark
Through-hole packages		Through-hole technology uses holes drilled through the PCB for mounting the components. The component has leads that are soldered to pads on the PCB to electrically and mechanically connect them to the PCB.
SIP	Single in-line package
DIP	Dual in-line package
CDIP	Ceramic DIP
CERDIP	Glass-sealed ceramic DIP
QIP	uadruple in-line package	Like DIP but with staggered (zig-zag)
SKDIP	Skinny DIP Standard DIP with 0.1 in (2.54 mm) pin spacing, rows 0.3 in (7.62 mm) apart
SDIP	Shrink DIP Non-standard DIP with smaller 0.07 in (1.78 mm) pin spacing
ZIP	Zig-zag in-line package
MDIP	Molded DIP
PDIP	Plastic DIP
SMT	Surface mount
CCGA	Ceramic column-grid array (CGA)
CGA	Column-grid array
CERPACK	Ceramic package
CQGP
LLP	Lead-less lead-frame package	A package with metric pin distribution (0.5–0.8 mm pitch)
LGA	Land grid array
LTCC	Low-temperature co-fired ceramic
MCM	Multi-chip module
MICRO SMDXT	Micro surface-mount device extended technology
DLCC	Dual lead-less chip carrier (ceramic)
PLCC	Plastic leaded chip carrier
Flat packages
CFP	Ceramic flat-pack
CQFP	Ceramic quad flat-pack
BQFP	Bumpered quad flat-pack
DFN	Dual flat-pack	No lead
ETQFP	Exposed thin quad flat-package
PQFN	Power quad flat-pack	No-leads, with exposed die-pad for heatsinking
PQFP	Plastic quad flat-package
LQFP	Low-profile quad flat-package
QFN	Quad flat no-leads package
QFP	Quad flat package
MQFP	Metric quad flat-pack	QFP with metric pin distribution
HVQFN	Heat-sink very-thin quad flat-pack, no-leads
SIDEBRAZE
TQFP	Thin quad flat-pack
VQFP	Very-thin quad flat-pack
TQFN	Thin quad flat, no-lead
VQFN	Very-thin quad flat, no-lead
WQFN	Very-very-thin quad flat, no-lead
UQFN	Ultra-thin quad flat-pack, no-lead
ODFN	Optical dual flat, no-lead	IC packaged in transparent packaging used in optical sensor
SOP	Small outline packages
CSOP	Ceramic small-outline package
DSOP	Dual small-outline package
HSOP	Thermally-enhanced small-outline package
MSOP	Mini small-outline package
PSOP	Plastic small-outline package
PSON	Plastic small-outline no-lead package
QSOP	Quarter-size small-outline package	The terminal pitch is 0.635 mm.
SOIC	Small-outline integrated circuit
SOJ	Small-outline J-leaded package
SON	Small-outline no-lead package
SSOP	Shrink small-outline package
TSOP	Thin small-outline package
TSSOP	Thin shrink small-outline package
TVSOP	Thin very-small-outline package
µMAX		Similar to a SOIC. (A Maxim trademark example)
WSON	Very-very-thin small-outline no-lead package
USON	Very-very-thin small-outline no-lead package	Slightly smaller than WSON
PMCP	Power Mount CSP (Chip Scale Package)	Variation of WLCSP, for power devices like MOSFETs. Made by Panasonic.
Fan-out WLCSP	Fan-out wafer-level packaging
eWLB	Embedded Wafer Level Ball Grid Array
COB	Chip on board	Bare die supplied without a package. It is mounted directly to the PCB using bonding wires and covered with a blob of black Epoxy. Also used for LEDs. In LEDs, transparent epoxy or a silicon caulk-like material that may contain a phosphor is poured into a mold containing the LED(s) and cured. The mold forms part of the package.
COF	Chip-on-flex	Variation of COB, where a chip is mounted directly to a flex circuit. Unlike COB, it may not use wires nor be covered with epoxy, using underfill instead.
TAB	Tape-automated bonding	Variation of COF, where a flip chip is mounted directly to a flex circuit without the use of bonding wires. Used by LCD driver ICs.
COG	Chip-on-glass	Variation of TAB, where a chip is mounted directly to a piece of glass - typically an LCD. Used by LCD and OLED driver ICs.
BGA	Ball grid array	Ball Grid Array BGA uses the underside of the package to place pads with balls of solder in grid pattern as connections to PCB.
BGA2	package (FCBGA-479)	Intel Mobile Celeron
CABGA	Chip Array Ball Grid Array	CBGA and PBGA denote the Ceramic or Plastic substrate material to which the array is attached. The die appears dark blue.
CTBGA	Thin Chip Array Ball Grid Array
CVBGA	Very Thin Chip Array Ball Grid Array
DSBGA	Die-Size Ball Grid Array
FBGA	also known as Fine Pitch Ball Grid Array (JEDEC-Standard) or	Fine Line BGA by Altera. Not to be confused with Fortified BGA.
FCmBGA	Flip Chip Molded Ball Grid Array
LBGA	Low-profile Ball Grid Array
LFBGA	Low-profile Fine-pitch Ball Grid Array
MBGA	Micro Ball Grid Array
MCM-PBGA	Multi-Chip Module Plastic Ball Grid Array
PBGA	Plastic Ball Grid Array
SuperBGA (SBGA)	Super Ball Grid Array
TABGA	Tape Array BGA
TBGA	Thin BGA
TEPBGA	Thermally Enhanced Plastic Ball Grid Array
TFBGA	Thin and Fine Ball Grid Array
UFBGA	Ultra Fine Ball Grid Array
UBGA
VFBGA	Very Fine Pitch Ball Grid Array
WFBGA	Very Very Thin profile Fine Pitch Ball Grid Array