Intransit Technologies’ BGA Reballing / BGA Repairing services allows us to reball any BGA pattern with our available custom-made library of over 1000 stencil hand wands. We can also custom design new stencils if you have a BGA pattern design we have never done before. We match the solder sphere sizes to form and fit per Manufacturer’s specifications. We are the go to team to support your all reballing needs. Lead Free / RoHS to Lead Conversion or Leaded to Lead Free / RoHS Conversion is no problem. We follow strict protocols to ensure your parts will be completed without any imperfections. Our process is so superior it will seem like factory new parts when we are all finished. We have engineers that understand the thermal temperature profiles required, understand prebaking is essential to dry out the components to remove chances of delamination or the popcorn effect. We have a state of the art temperature controlled reflow oven to ensure all reballed BGAs are properly secured to their pads. Just like our RoHS Conversion Services and Leaded Conversion Services we always pre bake and post bake to remove any moisture from the bodies.
What is RoHS Conversion?
Through a process of hot solder dipping we are able to convert the terminals on IC or Passive component packages to a RoHS based solder.
What is Leaded Conversion?
We can convert a RoHS solder based device by adding a LEADED Non-RoHS solder to the terminals/pins for mainly the military or medical applications where higher reliability is required and authorized by industry standards.
What are the solders available that you can retin or reball with?
Our main choice for RoHS conversion is SAC305( Sn96.5 Ag3.0 Cu.5), but to list some other and some include lead depending on you needs are; Sn63 Pb37, Sn5 Pb93.5 Ag1.5, Sn96.5 Ag3.5 and we have worked with many customer requested solders to meet a special need.
What type of packages can you work with?
Bulk, Tape and Reel, Tube and Trays.
What can you do automated?
Trays can be automated via our robotic machine to handle the pickup/load to auto flux to solder dip to place back in tray/unload. All the parts in the tray can be handled without human touch.
Do you bake the parts to ensure no damage occurs during services?
Yes! We bake the parts prior to a job and after a job to ensure there is no moisture inside the parts. This is a critical step to keep the integrity of the parts throughout the job.
XRF testing, Solderability testing, S-CAM, X-RAY and many others. Please inquire about the specific testing service you’d like and we can quote it accordingly.
My ICs are on PCBs; can you salvage these and convert them to RoHS compliant , Leaded or your preferred solder?
YES. Most IC packages from all types of PCBs. We can safely salvage devices using specially developed controlled IR, Hot-air or by chemical solder removal with no or minimal stress on the salvaged device. Salvaged devices can then be converted.
Can you convert Discrete devices?
Yes. We can convert almost all discrete devices both active and passive provided their levels of banned substances (apart from Lead) are below their respective RoHS thresholds.
What IC, PASSIVE, BGA, DISCRETE and other component packages can you convert or repair?
Almost all IC packages can be converted to Pb-free. This includes BGA, PGA, TSOP, SSOP, QFP, SOIC, PLCC, CDIP, PDIP and customized packages.
|Through-hole technology uses holes drilled through the PCB for mounting the components. The component has leads that are soldered to pads on the PCB to electrically and mechanically connect them to the PCB.
|Single in-line package
|Dual in-line package
|Glass-sealed ceramic DIP
|uadruple in-line package
|Like DIP but with staggered (zig-zag)
|Skinny DIP Standard DIP with 0.1 in (2.54 mm) pin spacing, rows 0.3 in (7.62 mm) apart
|Shrink DIP Non-standard DIP with smaller 0.07 in (1.78 mm) pin spacing
|Zig-zag in-line package
|Ceramic column-grid array (CGA)
|Lead-less lead-frame package
|A package with metric pin distribution (0.5–0.8 mm pitch)
|Land grid array
|Low-temperature co-fired ceramic
|Micro surface-mount device extended technology
|Dual lead-less chip carrier (ceramic)
|Plastic leaded chip carrier
|Ceramic quad flat-pack
|Bumpered quad flat-pack
|Exposed thin quad flat-package
|Power quad flat-pack
|No-leads, with exposed die-pad for heatsinking
|Plastic quad flat-package
|Low-profile quad flat-package
|Quad flat no-leads package
|Quad flat package
|Metric quad flat-pack
|QFP with metric pin distribution
|Heat-sink very-thin quad flat-pack, no-leads
|Thin quad flat-pack
|Very-thin quad flat-pack
|Thin quad flat, no-lead
|Very-thin quad flat, no-lead
|Very-very-thin quad flat, no-lead
|Ultra-thin quad flat-pack, no-lead
|Optical dual flat, no-lead
|IC packaged in transparent packaging used in optical sensor
|Small outline packages
|Ceramic small-outline package
|Dual small-outline package
|Thermally-enhanced small-outline package
|Mini small-outline package
|Plastic small-outline package
|Plastic small-outline no-lead package
|Quarter-size small-outline package
|The terminal pitch is 0.635 mm.
|Small-outline integrated circuit
|Small-outline J-leaded package
|Small-outline no-lead package
|Shrink small-outline package
|Thin small-outline package
|Thin shrink small-outline package
|Thin very-small-outline package
|Similar to a SOIC. (A Maxim trademark example)
|Very-very-thin small-outline no-lead package
|Very-very-thin small-outline no-lead package
|Slightly smaller than WSON
|Power Mount CSP (Chip Scale Package)
|Variation of WLCSP, for power devices like MOSFETs. Made by Panasonic.
|Fan-out wafer-level packaging
|Embedded Wafer Level Ball Grid Array
|Chip on board
|Bare die supplied without a package. It is mounted directly to the PCB using bonding wires and covered with a blob of black Epoxy. Also used for LEDs. In LEDs, transparent epoxy or a silicon caulk-like material that may contain a phosphor is poured into a mold containing the LED(s) and cured. The mold forms part of the package.
|Variation of COB, where a chip is mounted directly to a flex circuit. Unlike COB, it may not use wires nor be covered with epoxy, using underfill instead.
|Variation of COF, where a flip chip is mounted directly to a flex circuit without the use of bonding wires. Used by LCD driver ICs.
|Variation of TAB, where a chip is mounted directly to a piece of glass - typically an LCD. Used by LCD and OLED driver ICs.
|Ball grid array
|Ball Grid Array BGA uses the underside of the package to place pads with balls of solder in grid pattern as connections to PCB.
|Intel Mobile Celeron
|Chip Array Ball Grid Array
|CBGA and PBGA denote the Ceramic or Plastic substrate material to which the array is attached. The die appears dark blue.
|Thin Chip Array Ball Grid Array
|Very Thin Chip Array Ball Grid Array
|Die-Size Ball Grid Array
|also known as Fine Pitch Ball Grid Array (JEDEC-Standard) or
|Fine Line BGA by Altera. Not to be confused with Fortified BGA.
|Flip Chip Molded Ball Grid Array
|Low-profile Ball Grid Array
|Low-profile Fine-pitch Ball Grid Array
|Micro Ball Grid Array
|Multi-Chip Module Plastic Ball Grid Array
|Plastic Ball Grid Array
|Super Ball Grid Array
|Tape Array BGA
|Thermally Enhanced Plastic Ball Grid Array
|Thin and Fine Ball Grid Array
|Ultra Fine Ball Grid Array
|Very Fine Pitch Ball Grid Array
|Very Very Thin profile Fine Pitch Ball Grid Array
Reach out to our parts sepcialists for more infomation on pricing and availabilityRequest Parts Quote